生物通

基于COMSOL Multiphysics的电镀过程模拟及其对修复金杯内外表面的影响机制

针对传统金属文物修复成本高、流程复杂的问题，本研究基于COMSOL Multiphysics构建三维电镀模型，模拟Cu-Sn合金在金杯表面的电沉积过程，揭示几何边缘效应导致电流密度不均（峰值达23,000 A/m2），通过参数优化实现81.25% Cu-Sn均匀涂层，并证实浓度极化对离子传输 ...
JEC Composites

Comsol releases version 6.2 of Comsol Multiphysics software

COMSOL Multiphysics® version 6.2 introduces game-changing functionality for simulation apps and digital twins as well as faster solver technology. Users can now increase the computational speed of ...
Machine Design

COMSOL Multiphysics Version 6.4 Speeds Up Simulation with GPU-Accelerated Solvers

COMSOL Multiphysics version 6.4 accelerates engineering simulations and multiphysics models. Full GPU support across all physics delivers up to 5× speedups in benchmarks. COMSOL now supports GPU ...
The Engineer

COMSOL Speeds Simulation with Expanded NVIDIA GPU Support for COMSOL Multiphysics® Version 6.4

The latest version of the multiphysics simulation software introduces GPU acceleration through NVIDIA's CUDA® direct sparse solver, the Granular Flow Module and time-explicit structural dynamic ...